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Cosmoprof Bologna

March 16, 2024 - March 26, 2024
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Cosmoprof Bologna

Ching Fon’s Innovative Nail Polish Remover Package

The bottle offers a hands-free way to remove polish, using its star-cut sponge.

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By: Marie Redding

Senior Editor, Rodman Media

Ching Fon Industrial Co., Ltd will be at the show promoting its newly developed nail polish remover package. Its design offers users a convenient, hands-free nail polish removal method.

The bottle contains a sponge with a star cut insert. Placing a finger onto the sponge, in the center of the star shape, will remove polish directly from the nail. The package also features a cover insert, designed to wipe the remover off the nails and fingers.

More Info: Cosmoprof North America Booth #3031

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